On August 31st, the tenth technical forum/seminar of the company was successfully held. The theme of this forum was "Lead the future with high-speed computing and innovate with AI". This is the first time that the conference has been held in the form of "off-line main venue + on-line satellite venues", enabling approximately 300 people from three venues in two provinces to participate simultaneously. Chairman Xu Huan, Group Vice President Liu Yuancheng, PCB Vice President Han Zhiwei, Senior Advisor Yang Weisheng, etc. attended the forum at the main venue in Meizhou. The forum was hosted by Chen Shijin from the PCB Technical Management Department and Zhang Changming from the Technical Center of the Shenzhen Factory.
At the outset of the forum, Chairman Xu presented an effusive opening address. Proceeding from the current circumstances of the industry and the market, he conducted an in-depth analysis of the strategic demands of the company and the significance of technological innovation, and underlined the core position of technological innovation in the enterprise's development. He also encouraged all staff to make efforts to accelerate technological research and development as well as talent cultivation in order to cope with the challenges of the future market.
Senior Engineer Yang Weisheng shared a thematic report titled "Demand for Communication Substrate Materials and Circuit Board Processing under the Wave of AI" conducting an in-depth exploration of the new requirements for communication substrate materials and circuit board processing due to the advancement of artificial intelligence technology. It analyzed the demand variations for high-speed and high-performance substrate materials driven by AI, and how these alterations impact the design and manufacturing processes of circuit boards. Simultaneously, the report also deliberated on the innovative processing techniques and solutions adopted to fulfill these novel demands, with the aim of promoting the advancement of communication substrate materials and circuit board processing technologies to accommodate the requirements of the AI era.
Towards the end of the forum, General Manager Han and General Manager Gao Guihua delivered summary speeches. They indicated that currently, the company is undergoing a transformation towards a higher value-added order structure. We must maintain competitive technical and quality standards. Centering around the technical weaknesses that urgently require improvement, we should clearly define targeted goals, concentrate our efforts, and expedite the resolution and enhancement. He particularly emphasized that more learning and development opportunities should be offered to technical staff and a more open and innovative working environment should be constructed to jointly confront the challenges and opportunities brought about by technological innovation and facilitate the company's stable and high-quality development.
For many years, the technical forums have witnessed the company's persistent pursuit of technological innovation, offering a showcase for the company's technological innovation outcomes and a platform for the intellectual exchanges among technical staff. The splendid display of the award-winning papers fully embodies the company's R&D capabilities and serves as a medal of the company's technological advancements.
Facing the future, the company will persistently uphold the notion of "Innovation-driven Development", constantly explore new technologies, new materials, and new processes to satisfy the market's demand for high-performance PCBs. Meanwhile, we also anticipate collaborating hand in hand with colleagues from the industry chain in the field to jointly propel the continuous development of the electronic circuit industry and make more strenuous efforts to build a strong PCB nation.
