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Our Company Shines at 2026 NEPCON JAPAN
Source:Bomin Electronics
Published Time: 2026-02-13
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From January 23rd to 25th, NEPCON JAPAN, the premier event in Japan for electronic production equipment and the circuit board industry, was successfully held at Tokyo Big Sight. The company showcased its advanced products and solutions, including high-frequency & high-speed boards, high-end IC substrates, ceramic substrates, and rigid-flex boards. Our booth (East Hall 6, E24-20) attracted significant attention from global clients, partners, and industry experts, fostering active on-site exchanges and receiving positive feedback.

During the exhibition, we focused on high-end application fields such as AI servers, automotive electronics, communication technology, and medical/industrial control, highlighting core products like HDI (including Any-layer), high-layer-count boards, ceramic substrates, and rigid-flex boards. Our technical team engaged in in-depth discussions with numerous professional visitors from Japan, South Korea, Europe, America, and Southeast Asia. Particularly lively conversations centered on ceramic substrate and advanced HDI technologies, with many clients expressing immediate interest for further collaboration.

This participation served not only as a concentrated showcase of Bomin Electronics' cutting-edge technological achievements but also as a vital opportunity for in-depth, value-driven dialogue with global industry partners. Through exchanges with international clients, experts, and peers, the company gained further insights into cutting-edge market demands and technological trends, injecting new momentum into subsequent R&D innovation and market expansion.

While the grand event has concluded, a new chapter of collaboration is beginning. Bomin Electronics will continue to uphold the philosophy of open collaboration, translating the trust and expectations garnered at the exhibition into concrete actions to drive product upgrades and deepen customer partnerships. The company looks forward to joining hands with global partners to explore the future path of intelligent electronics manufacturing and empower the industry's high-quality development.

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